This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illust...
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This book gathers papers presented at the 9th International Conference on Computer Engineering and Networks (CENet2019), held in Changsha, China, on October 18–20, 2019. It examines innovations in the fields of computer engineering and networking and explores important, state-of-the-art developments...
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